I last wrote about Secure IC back in 2023, a provider of embedded security technologies and services. Cadence announced at the beginning of 2025 their intention to acquire this company, which warrants a check-in again on what they have to offer. Secure-IC addresses multiple markets, from automotive, through defense/space and… Read More
Intel’s Foundry Transformation: Technology, Culture, and Collaboration
Intel’s historical dominance in semiconductor process technology began to erode around 2018, as competitors started delivering higher performance at smaller nodes. In response, Intel is now doubling down on innovation across two fronts: advanced process nodes such as Intel 18A and 14A, and cutting-edge packaging technologies.… Read More
Keysom and Chipflow discuss the Future of RISC-V in Automotive: Progress, Challenges, and What’s Next
by, Tomi Rantakari CEO ChipFlow & Luca Testa COO Keysom
The automotive industry is undergoing a major transformation, driven by electrification, the rise of new market players, and the rapid adoption of emerging technologies such as AI. Among the most significant advancements is the growing adoption of RISC-V, an open-standard… Read More
Synopsys Executive Forum: Driving Silicon and Systems Engineering Innovation
The annual SNUG (Synopsys Users Group) conference, now in its 35th year, once again brought together key stakeholders to showcase accomplishments, discuss challenges, and explore opportunities within the semiconductor and electronics industry. With approximately 2,500 attendees, SNUG 2025 served as a dynamic hub for collaboration… Read More
Cut Defects, Not Yield: Outlier Detection with ML Precision
How much perfectly good silicon is being discarded in the quest for reliability? During high-volume chip manufacturing, aggressive testing with strict thresholds may ensure quality but reduces yield, discarding marginal chips that could function flawlessly. On the other hand, prioritizing yield risks allowing defective… Read More
Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More
Soitec: Materializing Future Innovations in Semiconductors
The semiconductor industry continues to evolve rapidly to meet the escalating demands for speed, power efficiency, and miniaturization. As traditional silicon-based technologies reach their physical and performance limits, engineered substrates and advanced material innovation have emerged as pivotal drivers of the… Read More
Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures
The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical… Read More
2025 Outlook with Uzi Baruch of proteanTecs
Tell us a little bit about yourself and your company.
I am the Chief Strategy Officer at proteanTecs where I oversee our organic and inorganic growth strategies, as well as our go-to-market. This includes collaboration with ecosystem partners, defining our business model, and creating value for our customers through a targeted… Read More
MCUs Are Now Embracing Mainstream NoCs
The moral of today’s story is that to succeed in a late-adopter market, sometimes you just have to wait for the market to catch up (assuming you have a strong early adopter market to buy your product today). I have been working with Arteris for 6+ years now promoting their NoC technology, and there was never any question that they offer… Read More
Intel Foundry Delivers!